Circuit Automation’s DP-VDM V1.2 vacuum system enhances and improves the Liquid photoimageable soldermask coating quality and performance. The compact DP-VDM unit incorporates a powerful vacuum degassing unit designed to remove entrapped air and solvent from LPI soldermask or other via plug material on printed circuit boards. By reducing the solvent and the entrapped air, micro bubbles are virtually eliminated. Proven especially effective on heavy copper panels with excessively tall trace heights and thick plating. The degassing process eliminates hole blowout and the need for step cure at final bake from vias. Tack dry and final bake times potentially may be reduced and the surface quality on the coating improved keeping photo tools cleaner.